DuploTEC SBF

Innovation in Triple Pack

 

Industry’s demands on high-tech bonding systems are increasing. Today, numerous safety components or entire assemblies are optimally connected using only adhesives.In order to create connections that are reliable for the various processes, the limits of conventional pressure-sensitive adhesives have to be surpassed and compromises between product development and process optimisation need to be amplified.

With their new product series DuploTEC SBF the Lohmann “Bonding Engineers” have provided the answer to these industrial challenges. Within the scope of structural bonding, innovative products that are much stronger than conventional pressure-sensitive adhesive connections have been developed.

Duplo TEC SBF is easy to handle, dimensional precise and pre-applicable. Thus, a fast and neat processing is guaranteed. Within the DuploTEC SBF series Lohmann distinguishes between three different technologies that are referred to as “Topaz”, “Onyx” and “Amber.”

TOPAZ Technology

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Technology:

  • High-performance Polyurethane adhesive system
  • Solvent-free, dry adhesive film
  • Latent reactive with structural bonding characteristics

Advantages:

  • Hardens within seconds
  • Low hardening temperatures
  • Optimally adjustable
  • Individual and precise adhesive dimensions down to 0,3 mm width
  • Stays elastic & flexible after hardening
  • High heat- and chemical resistance

 Process:

  • Pre-applicable between 60 - 80°C (140-176°F)
  • 3 months storage stability after pre-application
  • Hardens between 70-160°C (160-320°F)
  • Hardens after 3 seconds
  • Pressure:min. 15N/cm²

AMBER Technology

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Technology:

  • First commercially available cyanoacrylate adhesive system as roll good
  • Bonding film with high immediate adhesion
  • Reactive with structural adhesive characteristics
  • Patent pending

 Advantages:

  • Unites the advantages of adhesive tapes and liquid adhesives
  • As easy to apply as an adhesive tape
  • High initial tack allows safe & easy fixation
  • Well suitable for temperaturesensitive materials

 Process:

  • Auto cure bonding at room temperature and humid conditions
  • Hardening reached at 23°C (74°F) after 48h
  • Hardening reached at 70°C (160°F) after 1h
  • Pressure: min. 0,1N/cm²

ONYX Technology

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Technology:

  • Epoxy based thermosetting bonding film
  • Bonding film with initial adhesion
  • Reactive with structural bonding characteristics
  • Various formulations and coating technologies available

 Advantages:

  • As easy to apply as an adhesive tape
  • Compensation of high static and dynamic forces
  • Extremely resistant to ageing and chemicals
  • High temperature resistance

 Process:

  • Hardening between 130 -180°C (260-360°F)
  • Hardening after min. 10 min
  • Pressure: min. 1N/cm²
  • Adaptable to individual process conditions
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Easy & Precise Efficient
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Flexible Quick & Reliable